AMKR

Amkor Technology, Inc.

Amkor Technology, Inc. is classed by the SEC under Semiconductors & Related Devices (industry code 3674), based in Tempe, AZ. In its latest annual figures on file, for the fiscal year ended 2025-12-31, it reported revenue of $6.7 billion and a profit of $374 million (its filed statements).

Capacity business Semiconductors & Related Devices Tempe, AZ filings since 1997 9 of 9 filed

Sector peers: SWKSGFSTSEMDQ

5.3/10headline grade
vs its business-model standard

Three tenses, nine metrics. Unseen metrics stay unseen; the grade never fakes a number. Proxy era: provisional values, marked. Weighed as a capacity business: from the semis smell test of 2026-08-06 (a foundry or assembly service). All three tenses have at least two readings, so the archetype blend applies as printed.

The grade, in three tenses

Headline 5.3 out of ten, 9 of 9 metrics filed: past 6.3 out of ten, present 5.6 out of ten, future 3.9 out of ten. The past asks what it actually did, the present what it is doing right now, the future what it is set up to do next.

The nine metrics

  • Surviving crises (past): 7.6 out of ten. No warning events in its filings since 2017. 76th percentile among 99 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).
  • Track record (past): 6.1 out of ten. +6.5% a year over 8 filed years; profitable in 8 of 8. 61st percentile among 93 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).
  • Shareholder treatment (past): 4.9 out of ten. Share count grew 0.3% a year. 10% of cash flow returned. Insiders: 41 sales, 0 purchases. 49th percentile among 67 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).
  • Financial health (present): 4.7 out of ten. ROE 8%: 8¢ of profit per shareholder dollar. Leverage 45%: owes 45¢ per asset dollar. 47th percentile among 95 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).
  • Industry position (present): 6.5 out of ten. top 35% of 97 in its family; net margin 5.6%. 65th percentile among 97 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).
  • Leadership (present): 5.2 out of ten. top 48% of 66 in its family for leadership; chief executive since 2026. 52nd percentile among 66 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-09).
  • Room to expand (future): 2.4 out of ten. bottom 24% of 94 in its family for room to expand. 24th percentile among 94 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).
  • Growth drivers (future): 4.2 out of ten. bottom 42% of 93 in its family for growth drivers. 42nd percentile among 93 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).
  • Expectations vs reality (future): 4.5 out of ten. bottom 45% of 88 in its family for expectations against reality. 45th percentile among 88 sector filers. A production reading, recomputed from the filings on every data build (read from EDGAR 2026-10-12).

The filing record

Newest annual report: Form 10-K filed 2026-02-20 for the period ended 2025-12-31 (on EDGAR). Newest quarterly report: Form 10-Q filed 2026-07-28 for the period ended 2026-06-30 (on EDGAR). Newest results release: Form 8-K filed 2026-07-27 (on EDGAR). Newest filing: Form 4, 2026-10-06. Filings on record since 1997. Read from EDGAR 2026-10-12.

How the company works

Read from its Form 10-K filed 2026-02-20.

The people

Kevin K. Engel became president and chief executive on January 1, 2026, succeeding Giel Rutten, who ran Amkor from June 2020 until he retired in December 2025 and remains a director. Engel is a company veteran: he joined in August 2004, rose through bump services and the flip chip and wafer-level business unit, became executive vice president for the business units in February 2023 and was chief operating officer from February 2025. Rutten came to Amkor in February 2014 from Ledzworld, an LED technology company, after a career that began at Philips Semiconductors, later NXP, in 1984. [1, 2, 3, 4, 5]

Megan Faust has been chief financial officer since September 2016 and treasurer since February 2022; she joined the finance department in 2005 after ten years as an auditor at KPMG. Farshad Haghighi, chief sales officer since August 2022, joined Amkor in 1994. Mark N. Rogers, general counsel since June 2019, came from ON Semiconductor. [6, 7, 8, 9]

Control rests with the Kim family. Susan Y. Kim, a director since February 2015, has chaired the board since October 2024, and she, her family and affiliates owned about 49.4% of the stock as of February 2026; the group includes her father, James J. Kim, and her brother John T. Kim. The annual report says that acting together they can effectively determine or substantially influence the election of the board. Gil C. Tily serves as lead independent director. [10, 11, 12, 13, 14, 15]

At the end of 2025 Amkor employed 30,800 people in 12 countries, about 95% of them in the Asia-Pacific region, 4% in Europe and 1% in the United States. Some factory employees in China, Japan, Korea, Malaysia, Portugal, Taiwan and Vietnam belong to unions under collective agreements, and it reports no work stoppage at any of its factories. [16]

How it operates

Amkor packages and tests chips that other companies design and make. It describes itself as the world's largest US-headquartered outsourced semiconductor assembly and test provider, or OSAT. Customers send it finished wafers, which generally remain their property, and Amkor bumps, probes, thins, packages and tests the chips and ships them on. It works for integrated device makers, fabless chip designers, electronics makers and contract foundries. [17, 18, 19, 20]

Its customers include most of the world's largest chip companies, and the ten largest took 72% of 2025 net sales. Direct sales to Apple made up 29.8% of net sales and to Qualcomm 11.1%. By end market, communications (smartphones and tablets) made up 46%, computing (data center, infrastructure, PCs and storage) 20%, automotive, industrial and other 19%, and consumer devices 15%. By the location of customers' headquarters, the United States accounted for 65.6% of net sales, Europe, the Middle East and Africa 12.7%, the rest of Asia-Pacific 10.9% and Japan 10.8%. [21, 22, 23, 24]

It makes everything in its own plants, almost all in Asia: factories in Korea, the Philippines, Japan, China, Taiwan, Malaysia and Vietnam, plus one in Portugal, 12,633,000 square feet in all, with executive offices in Arizona and Singapore. Korea is the core, with 4,481,000 square feet, its main research and development center and more than half its plant and equipment by value. A factory in Vietnam opened in 2024, and in 2025 construction began on the first phase of a facility in Arizona of about 1.8 million square feet, where manufacturing is expected to begin in the first half of 2028. [25, 26, 27, 28, 29, 30, 31]

Materials are its largest cost, 55.2% of net sales in 2025, against 10.4% for labor and 8.7% for depreciation. The main ones are laminate substrates, ICs, capacitors, leadframes and bonding wires, mostly from a limited group of suppliers; its core machines are wire bonders, die bonders, chip shooters and die attach, with testers, handlers and probers for test. It reports in US dollars, the functional currency of all its subsidiaries except those in Japan, which use the yen. [32, 33, 34, 35, 36, 37]

The specifics

Its technology lies in how chips are joined and stacked: flip chip, wafer-level packaging, high-density fan-out (its SWIFT and S-Connect), and 2.5D packages that use silicon interposers to put high-bandwidth memory and graphics processors in one package. It also builds advanced system-in-package modules, several chips and components in one small package for phones, wearables and cars, which brought in about 3,080 million dollars in 2025, and it is developing co-packaged optics and copper hybrid bonding. It holds patents but says it is not materially dependent on any one patent or technology. [38, 39, 40, 41, 42, 43]

It names its main rivals as ASE Technology, JCET Group and Powertech Technology, along with contract foundries and electronics manufacturers that offer some advanced packaging and its own customers' in-house capacity. It says trade tensions have increased competition from Chinese firms supporting a China-for-China supply chain. [44, 45]

Governments shape where it builds and what it keeps. The Commerce Department awarded up to 407 million dollars of CHIPS Act funding for the Arizona Facility, tied to construction and production milestones and restrictions on certain activities, and its subsidiaries in Korea, Singapore and Vietnam run under conditional reduced tax rates that rise as they expire. Past deals still surface: in 2025 it received 72.8 million dollars from insolvency payments tied to its May 2017 purchase of Nanium, and remitted 40.4 million of it to the former owners. [46, 47, 48]

What drives growth, line by line

Advanced Products. 5.6 billion dollars, 82.8% of 2025 net sales, up 7.4%. The line covers flip chip, memory and wafer-level packaging and the tests that go with them, where data center, AI and premium phone work sits; its share of sales has risen from 77.4% in 2023. [24, 49, 50]

Mainstream Products. 1.2 billion dollars, 17.2% of net sales, up 0.8%: wirebond packages, power device packaging and their tests, down from 22.6% of sales in 2023. [24, 49, 50]

Net sales rose 6.2% to 6.7 billion dollars. The filing credits higher sales in all end markets: computing up 16% on AI-related PC devices and networking infrastructure, automotive and industrial up 8% on advanced content for driver-assistance systems, consumer up 9% and communications up 1% on wearables and premium smartphones. Gross margin slipped to 14.0% from 14.8% on higher overhead and pay, and the ramp of the Vietnam factory held it back. [51, 52, 53, 54, 55]

The quarterly report for the three months to June 30, 2026 shows a faster pace: net sales up 25.6% on a year earlier, with communications up 32%, automotive and industrial up 35% and computing up 23% on data center strength, and gross margin up to 16.8% from 12.0% on fuller factories. [56, 57, 58]

What comes next, in the company's own words: capital spending of about 2.5 billion to 3.0 billion dollars in 2026, up from 2025 mainly for the Arizona Facility. [59]

What the desk infers (inferred, not filed)

  • Much of Amkor's advanced system-in-package business is most likely done for Apple, so its largest product family and its largest customer largely overlap. Because: Direct sales to Apple made up 29.8% of 2025 net sales. [21] Advanced system-in-package modules brought in about 3,080 million dollars in 2025, close to half of net sales. [41, 49] Those modules are found in smartphones and tablets, wearables and other devices. [42] Communications (smartphones and tablets) made up 46% of sales, and the company claims a strong position across multiple device functions in premium and high-tier smartphones. [23, 60] Confidence 55 of 100. Wrong if: A filing showing that Apple buys mainly flip chip or wafer-level packages rather than system-in-package modules, or that most system-in-package sales go to other customers.
  • Amkor is American by headquarters and by customers but Korean by plant: its manufacturing weight sits in Korea while most of its sales are booked with US-headquartered companies. Because: Korea holds more than half of its net plant and equipment by value and 4,481,000 of its 12,633,000 square feet. [27, 25] Its main research and development center is in Korea. [28] Only about 1% of its 30,800 employees are in the United States. [16] Customers headquartered in the United States accounted for 65.6% of net sales. [24, 22] Confidence 85 of 100. Wrong if: A year-end filing showing Korea with less than half of Amkor's net plant and equipment, or US-headquartered customers below half of net sales.
  • Amkor's margins turn on how full its factories run: with much of its cost fixed, strong sales growth lifts gross margin quickly, while slow growth and a new factory's ramp pull it down. Because: The company says a substantial portion of its factory costs is fixed, so revenue and gross margin move together. [61] In the second quarter of 2026 net sales rose 25.6% and gross margin rose 4.8 points to 16.8%, which the filing puts down to higher factory utilization. [56, 58, 62] In 2025, with sales up 6.2%, gross margin fell to 14.0% from 14.8%, held back by the ramp of the Vietnam factory. [53, 54, 55] Confidence 75 of 100. Wrong if: A period in which Amkor's net sales rise sharply while its gross margin falls for reasons other than start-up costs at new factories.

Sources

  1. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Kevin Engel, who has held progressively senior roles throughout his over 20-year tenure with Amkor, most recently as Executive Vice President and Chief Operating Officer, succeeded Mr. Rutten as CEO effective January 1, 2026.”
  2. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Kevin K. Engel has served as our President and Chief Executive Officer and Director since January 2026. Previously, Mr. Engel served as our Executive Vice President, Chief Operating Officer from February 2025 to December 2025, and our Executive Vice President, Business Units from February 2023 to February 2025.”
  3. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Prior to that time, Mr. Engel served as Corporate Vice President, Flip Chip/Wafer Level Business Unit from January 2020 to February 2023. Previously, he served as our Senior Vice President, Bump Services from August 2016 to January 2020. Prior to that time, Mr. Engel served as our Vice President, Bump Services from January 2013 to August 2016 and in various similar roles since joining the Company in August 2004.”
  4. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Giel Rutten has been a director of Amkor since June 2020. Mr. Rutten served as Amkor’s President and Chief Executive Officer from June 2020 until his retirement in December 2025. To assist in the leadership transition, Mr. Rutten provided strategic and advisory services to the Company until March 31, 2026. Mr. Rutten joined Amkor in February 2014 as Executive Vice President of Advanced Products”
  5. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Before joining Amkor, he served as Chief Executive Officer of Ledzworld, an LED technology company. Prior to that, he served as Senior Vice President for the Home Business Unit of NXP B.V. (formerly Philips Semiconductors). Mr. Rutten first joined Philips Semiconductors in 1984”
  6. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Megan Faust has served as our Executive Vice President and Chief Financial Officer since November 2019, was appointed Treasurer in February 2022, and served as Corporate Vice President and Chief Financial Officer from September 2016 to November 2019. Previously, Ms. Faust served as the Company’s Senior Vice President, Corporate Controller from March 2013 to September 2016 and in various other roles in the Finance Department since joining the Company in 2005. Prior to joining the Company, Ms. Faust served as an auditor with KPMG LLP for 10 years.”
  7. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Farshad Haghighi has served as our Executive Vice President, Chief Sales Officer since August 2022.”
  8. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Senior Vice President of Western Sales from 2010 to 2011, and in various other sales management and engineering positions since joining Amkor in 1994.”
  9. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Mark N. Rogers was appointed Executive Vice President, General Counsel, and Corporate Secretary in June 2019. Mr. Rogers has more than 30 years of corporate legal and transaction experience, including more than four years at ON Semiconductor Corporation”
  10. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Susan Y. Kim has been a director of Amkor since February 2015 and has served as Chairman of the Board of Directors since October 2024.”
  11. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “As of February 12, 2026, Susan Y. Kim, the Chairman of our Board of Directors and members of the Kim family and affiliates owned approximately 122.1 million shares, or approximately 49.4%, of our outstanding common stock.”
  12. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “Mr. Kim and Mrs. Kim are husband and wife and are the parents of Ms. Kim, David D. Kim, and John T. Kim.”
  13. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “511,645 shares are held by Ms. Kim’s father, James J. Kim, individually”
  14. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Ms. Kim and her family and affiliates, acting together, have the ability to effectively determine or substantially influence matters submitted for approval by our stockholders including the election of our Board of Directors”
  15. Amkor Technology, Inc., Form DEF 14A filed 2026-04-02: “The independent directors have designated Mr. Tily to serve as Lead Independent Director of the Board.”
  16. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “As of December 31, 2025, Amkor employed 30,800 employees, of whom approximately 95%, 4% and 1% resided in the Asia-Pacific region, Europe and the United States, respectively. Our global workforce spans 12 countries, reflecting various cultures, backgrounds, ages, genders and ethnicities. Our employees in France, Germany, the Philippines, Singapore and the United States are not represented by any union. Certain employees at our factories in China, Japan, Korea, Malaysia, Portugal, Taiwan and Vietnam are members of a union, and we operate subject to collective bargaining agreements that we have entered into with these unions.”
  17. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Amkor is the world’s largest U.S. headquartered outsourced semiconductor assembly and test service provider (“OSAT”) and is a global leader in outsourced semiconductor packaging and test services.”
  18. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “The packaging and test services we provide occur subsequent to wafer fabrication, and the wafers that we receive from our customers are generally consigned to us.”
  19. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “We provide turnkey packaging and test services including wafer bump, wafer probe, wafer back-grind, package design, packaging, burn-in, system level and final test and drop shipment services.”
  20. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “We provide our services to integrated device manufacturers (“IDMs”), “fabless” semiconductor companies, original equipment manufacturers (“OEMs”) and contract foundries.”
  21. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Our customers include most of the world’s largest semiconductor companies. Our ten largest customers accounted for 72% of our net sales in 2025. Direct sales to Apple and Qualcomm accounted for 29.8% and 11.1% of our net sales, respectively, for the year ended December 31, 2025.”
  22. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Net sales by region based on customer headquarters location consist of the following”
  23. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Communications (smartphones, tablets) 46 % 48 % 50 % Computing (data center, infrastructure, PC/laptop, storage) 20 % 19 % 16 % Automotive, industrial and other (ADAS, electrification, infotainment, safety) 19 % 18 % 21 % Consumer (AR & gaming, connected home, home electronics, wearables) 15 % 15 % 13”
  24. The record on this page: revenue by line and by geography, as tagged in the annual report (the SEC's financial statement data sets)
  25. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “China (1) 1,398,000 — 1,398,000 Japan (2) 1,489,000 286,000 1,775,000 Korea (2) 4,481,000 — 4,481,000 Malaysia (1) 434,000 — 434,000 Philippines (3) 765,000 557,000 1,322,000 Portugal 583,000 — 583,000 Taiwan (1) 1,161,000 12,000 1,173,000 Vietnam (1) 1,467,000 — 1,467,000 Total all facilities 11,778,000 855,000 12,633,000”
  26. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Our executive offices, which are leased, are located in Arizona and Singapore.”
  27. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Korea 2,098,150 1,923,953 Malaysia 47,221 55,166 Philippines 187,169 172,180 Portugal 162,916 130,653 Taiwan 352,692 322,539 Vietnam 517,847 471,581 Other foreign countries 1,465 1,553 Total foreign countries 3,764,912 3,525,640 United States 105,896 50,508 Total property, plant and equipment, net $ 3,870,808 $ 3,576,148”
  28. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Our research and development teams are located across our facilities with the primary Center of Excellence based in Korea.”
  29. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “In addition, we continue to scale production in our Vietnam facility, which opened in 2024, further increasing our capacity and operational flexibility in Asia.”
  30. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “During 2025, we began construction of the first phase of the Arizona Facility, which will have approximately 1.8 million square feet of space. Manufacturing is expected to begin in the first half of 2028.”
  31. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “We have significant packaging and test services and other operations in China, Japan, Korea, Malaysia, the Philippines, Portugal, Singapore, Taiwan and Vietnam, and the Arizona Facility is a new factory under construction in the United States.”
  32. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Materials 55.2 % 55.1 % 55.1 % Labor 10.4 % 9.9 % 9.9 % Depreciation 8.7 % 8.5 % 8.9”
  33. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “The principal materials used in our packaging process are laminate substrates, ICs, capacitors, leadframes and bonding wires.”
  34. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “We obtain the materials required for packaging services from various suppliers and source most of our materials, including critical materials such as leadframes, laminate substrates and bonding wires, from a limited group of suppliers.”
  35. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “The primary types of equipment used in providing our packaging services are wire bonders, die bonders, chip shooters and die attach.”
  36. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “The primary equipment used in the testing process includes testers, handlers and probers.”
  37. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “The U.S. dollar is the functional currency of our subsidiaries other than our Japan operations.”
  38. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Our technology leadership encompasses areas such as high density fan-out (“HDFO”), including SWIFT and S-Connect packaging technologies, 2.5D integration, advanced flip chip, fine pitch bumping, wafer-level processing and advanced system-in-package (“SiP”) solutions”
  39. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Some FCBGA products incorporate 2.5D technology, which utilizes high density silicon interposers to enable the integration of high-performance chips, such as high bandwidth memory and graphics processors, into a single package.”
  40. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Advanced SiP modules combine multiple semiconductor and other electronic components with different functionalities into a single package.”
  41. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “In 2025, 2024 and 2023, we had net sales of approximately $3,080 million, $3,085 million and $2,955 million, respectively, from our advanced SiP modules, which are mostly included in Advanced Products, depending upon the interconnect technology used in the module.”
  42. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Advanced SiP modules are found in many products including smartphones and tablets, automobiles, IoT wearables, high-performance gaming systems, computers and network systems.”
  43. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Although our patents are an important element of our intellectual property strategy, we are not materially dependent on any one patent or any one technology.”
  44. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “The outsourced semiconductor packaging and test market is highly competitive, and geopolitical trade tensions have increased competition from Chinese firms supporting a China-for-China supply chain. We face competition from established packaging and test service providers primarily located in Asia, including ASE Technology, JCET Group and Powertech Technology.”
  45. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Additionally, we compete with contract foundries and electronic manufacturing service providers or contract electronics manufacturers, which offer certain types of advanced packaging. Our IDM customers also evaluate our services and scale against their own in-house capabilities.”
  46. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “In December 2024, the Commerce Department awarded us up to $407 million in direct funding pursuant to the CHIPS Act for the Arizona Facility. This award requires us to achieve construction and production milestones and restricts us from undertaking certain activities.”
  47. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “During 2025, 2024 and 2023, our subsidiaries in Korea, Singapore and Vietnam operated under various conditional reduced tax rates. As these conditional reduced tax rates expire, income earned in these jurisdictions will be subject to higher statutory income tax rates”
  48. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “In June 2025, we received $72.8 million for the Nanium Insolvency Receipt. The terms of the purchase agreement from our Nanium acquisition in May 2017 required us to remit any insolvency payments received to the selling shareholders, less certain costs, including tax costs, incurred by us. In 2025, we remitted $40.4 million to the selling shareholders.”
  49. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “For the Year Ended December 31, 2025 2024 2023 (In millions, except percentage of net sales) Advanced Products $ 5,556 82.8 % $ 5,175 81.9 % $ 5,033 77.4 % Mainstream Products 1,152 17.2 % 1,143 18.1 % 1,470 22.6 % Total net sales $ 6,708 100.0 % $ 6,318 100.0 % $ 6,503 100.0”
  50. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “We refer to our flip chip, memory, wafer-level processing and related test services as “Advanced Products” and to our wirebond packaging, power device packaging and related test services as “Mainstream Products.””
  51. The record on this page: the filed annual figures (EDGAR's company facts)
  52. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “The $390.3 million increase in net sales in 2025 compared to 2024 was primarily due to higher sales across all end markets. The computing end market increased 16% in 2025 compared to 2024 primarily driven by strength in AI related PC devices and networking infrastructure. The automotive and industrial end market increased 8% in 2025 compared to 2024 primarily due to strong advanced content growth for ADAS applications. The consumer and communications end markets grew 9% and 1%, respectively, in 2025 compared to 2024, primarily driven by strong demand for IoT wearables and premium tier smartphones.”
  53. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Gross margin decreased for 2025 compared to 2024, primarily due to increased overhead and employee compensation costs, partially offset by higher factory utilization driven by the increase in net sales and a gain recognized on the sale of certain machinery and equipment. Gross profit and gross margin for 2025 were also constrained by the ramp up of production at the Vietnam Facility, which is in the early stages of high-volume manufacturing.”
  54. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Net sales $ 6,707,981 $ 6,317,692 $ 6,503,065 $ 390,289 6.2 % $ (185,373) (2.9)”
  55. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Gross profit $ 938,599 $ 933,212 $ 943,153 $ 5,387 $ (9,941) Gross margin 14.0 % 14.8 % 14.5 % (0.8) % 0.3”
  56. Amkor Technology, Inc., Form 10-Q filed 2026-07-28: “Net sales $ 1,897,965 $ 1,511,392 $ 386,573 25.6 % $ 3,582,666 $ 2,832,967 $ 749,699 26.5”
  57. Amkor Technology, Inc., Form 10-Q filed 2026-07-28: “The communications end market grew 32% and 37% and the automotive and industrial end market grew 35% and 31% for the three and six months ended June 30, 2026 compared to 2025, respectively, primarily due to increased supported content in premium tier smartphones and growth in ADAS and industrial applications. Additionally, the computing end market grew 23% and 21% for the three and six months ended June 30, 2026 compared to 2025, respectively, primarily driven by strength in datacenter.”
  58. Amkor Technology, Inc., Form 10-Q filed 2026-07-28: “Gross margin for the three months ended June 30, 2026 increased to 16.8% compared to 12.0% for the three months ended June 30, 2025. The increase in gross margin was primarily due to higher factory utilization driven by the increase in net sales.”
  59. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “We expect that our 2026 capital expenditures will be approximately $2.5 billion to $3.0 billion. The increase from 2025 is primarily due to the construction of the Arizona Facility.”
  60. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “We have a strong position across multiple device functionalities within premium and high-tier smartphones.”
  61. Amkor Technology, Inc., Form 10-K filed 2026-02-20: “Since a substantial portion of the costs at our factories is fixed, there tends to be a strong relationship between our revenue levels and gross margin.”
  62. Amkor Technology, Inc., Form 10-Q filed 2026-07-28: “Gross margin 16.8 % 12.0 % 4.8 % 15.6 % 12.0 % 3.6”

Where the revenue comes from

Product and service lines in fiscal 2025: Advanced Products 83%, Mainstream Products 17%. By geography: United States 66%, EMEA 13%, Asia Pacific (excluding Japan) 11%, Japan 11%. As tagged in its annual report (Form 10-K, filed 2026-02-20).

Who runs it

Rutten, Guillaume Marie Jean (President and CEO); Engel, Kevin (President and CEO); Kim, James J (Chief Executive Officer); Haghighi, Farshad (Executive Vice President); Faust, Megan (CFO); Buntyn, Cherie (Chief Accounting Officer); Tily, Gil C. (CAO & General Counsel); Rogers, Mark N (EVP & General Counsel); Alexander, Douglas A (director); Carolin, Roger Anthony (director); and 8 more. 18 officers and directors have filed their own trades in the last fifteen months, names and titles as filed with the SEC, through 2026-10-06.

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